Stress/Failure Analysis Software for Multi- Material Interfaces: Final Report
نویسنده
چکیده
The objective of the project was to provide means for establishing reliable quantitative failure initiation criteria for multiple chip modules (MCMs), electronic packages, laminated composites and adhesively bonded joints. During Phase I, an easy-to-use, reliable and robust software was developed, with a graphic user interface, based on the innovative methods presented in [1], [2] and [3], for the computation of generalized flux/stress/thermal intensity factors (GFIFs/GSIFs/ TSIFs) and the strength of the singularities for any multi-material interface problem involving isotropic or anisotropic materials, subject either to mechanical or thermal loading, in a two-dimensional setting. The existing software product Stress Check provided the framework for this development. Stress Check is based on the pand hp-version of the finite element method, capable of a-posteriori error estimation in terms of the data of interest.
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